Speakers cover packaging and processing technology

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AUSPACK speakers include 8 international speakers and 37 speakers overall, covering an extensive range of topics.

AUSPACK speakers include 8 international speakers and 37 speakers overall, covering an extensive range of topics.

With eight international speakers and 37 speakers overall covering an extensive range of topics over four days, the 2015 National Technical Forums are another reason to make sure you attend AUSPACK on the 24th to 27th of March.

Registrations are now available for the 2015 National Technical Forums which will be held as a part of Packaging & Processing Week, in conjunction with AUSPACK.

Following a number of highly successful National Technical Forums over the last six AUSPACK exhibitions, the 2015 Forums will be designed to deliver a four-day educational program that will cover a broad range of topics relating to the theme Open Innovation & Collaboration.

Keynote speakers include: Innes Willox, chief executive officer, Australian Industry Group, Jane Anderson, personal branding expert and author of IMPACT, Adam Robinson, senior packaging technologist, Coles, Chris Smith, general manager – sales & marketing, Orora Beverage and Daniel Grimsey, packaging analyst, Euromonitor.

International Speakers include: Klas Bengtsson, global product manager, ABB Robotics, Dr Bradley Fain, Georgia Tech Research Institute, Steve Davies, director of corporate communications, Nature Works, Oliver Trodel, product support, Competence Centre Filling Technology, KHS, Peter Buchhauser, head of sales Asia Pacific, Krones, Toru Ichikawa, managing director, Hosokawa Yoko, Cooper Tyo, Asia Pacific business manager, Automated Packaging Systems and Gurjinder Singh, area sales manager, Oceania and NW US, Tomra Sorting Solutions.

Other speakers that will be presenting include: Dr Barbara Butow, senior scientist, Food Standards ANZ, Marlene Cronje-Vermeulen MAIP, packaging technologist, Diageo Australia, Jackie Smiles, environment & sustainability manager, Blackmores, Stephen Pahl, research scientist, SARDI and Jacqui Wilson-Smith, global head of marketing & innovation, to name just a few.

Sponsors of the 2015 National Technical Forums are Integrated Machinery, GE, KHS, GunnLab, Metalprint, Rockwell Automation, UPM Raflatac, Wellman Packaging and Comrack Packaging.

To register to attend the 2015 National Technical Forums visit the events section on www.aipack.com.au

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